High Performance Adhesives

Epiform® - Coating Liquid for Magnetic Bonding

These one-part Epiform adhesives have strong magnetic bonding and are resins used for motors. Many grades are available, with high adhesive strength, impact resistance, and high heat resistance. 

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SOMATECT KZ Series are heat-curable resins for semiconductor sealing. Various resins for different applications such as glob-top resins, underfill resins and CSP reinforcing resins, etc. are available.

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SOMAKOTE IR series are heat-curable SMD adhesives. Various adhesives are available from high adhesion to low temperature cure, pressure-syringe dispensing, screen printing use, etc.

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